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? semiconductor components industries, llc, 2014 march, 2018 ? rev. 2 1 publication order number: lb11867rv/d lb11867rv variable speed single\phase full\wave pre\driver for fan motor monolithic digital ic overview lb11867rv is a single-phase bipolar driving motor pre-driver with the variable speed function compatible with external pwm signal. with a few external parts, a highly-efficient and highly-silent variable drive fan motor with low power consumption can be achieved. this product is best suited for driving of the server requiring large air flow and large current and the fan motor of consumer appliances. features ? single-phase full-wave driving pre-driver ? low-saturation drive using external pmos ? nmos enables high-efficiency low power-consumption drive ? variable speed control possible with external pwm input ? separately-excited upper direct pwm (f =30 khz) control method ensures highly silent speed control ? current limiting circuit incorporated ? chopper type current limiting made at startup and during lock ? reactive current cut circuit incorporated ? reactive current before phase changeover is cut, ensuring highly silent and low power-consumption drive ? minimum speed setting pin ? minimum speed can be set by setting the resistance ? soft start setting pin ? lock protection and automatic reset circuits incorporated ? rd (lock detection) output ? thermal shutdown circuit incorporated typical applications ? computing & peripherals ? industrial ? server ? vending machine www. onsemi.com ssop16 case 565am marking diagram xxxx = specific device code y = year m = month ddd = additional traceability data xxxxxxxxxx ymddd pin assignment out1p out1n sgnd 5vreg s ? s ct in+ in ? 16 9 out2p out2n v cc sense rmi vth cpwm rd 1 8 (top view) see detailed ordering and shipping information on page 9 of this data sheet. ordering information
lb11867rv www. onsemi.com 2 specifications absolute maximum ratings (t a = 25 c) symbol parameter conditions ratings unit v cc max v cc pin maximum supply voltage 18 v ioutn max outn pin maximum output current 20 ma ioutp max outp pin maximum sink current 20 ma vout max out pin output withstand voltage 18 v vvth, vrmi max vth, rmi pins withstand voltage 7 v v s ? s max s ? s pin withstand voltage 7 v v rd max rd output pin withstand voltage 19 v i rd max rd pin maximum output current 10 ma i 5vreg max 5vreg pin maximum output current 20 ma p d max allowable power dissipation with specified substrate (note 1) 800 mw t opr operating temperature (note 2) ? 30 to 95 c t stg storage temperature ? 55 to 150 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. specified substrate: 114.3 mm 76.1 mm 1.6 mm, glass epoxy board. 2. t j max = 150 c must not be exceeded. recommended operating conditions (t a = 25 c) symbol parameter conditions ratings unit v cc v cc supply voltage 5.5 to 16 v vth, rmi vth, rmi input voltage range 0 to 5 v vicm hall input common-phase input voltage range 0.2 to 3 v functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability. electrical characteristics (t a = 25 c, v cc = 12 v) symbol parameter conditions min typ max unit i cc 1 circuit current during drive 5.5 7.5 9.5 ma i cc 2 during lock protection 5.5 7.5 9.5 ma 5vreg 5vreg voltage i 5vreg = 5 ma 4.80 4.95 5.10 v vlim current limiting voltage 185 200 215 mv v cpwm h cpwm pin ?h? level voltage 2.8 3.0 3.2 v v cpwm l cpwm pin ?l? level voltage 0.9 1.1 1.3 v i cpwm 1 cpwm pin charge current v cpwm = 0.5 v 24 30 36 a i cpwm 2 cpwm pin discharge current v cpwm = 3.5 v 21 27 33 a fpwm cpwm oscillation frequency c = 220 pf ? 30 ? khz v ct h ct pin ?h? level voltage 2.8 3.0 3.2 v v ct l ct pin ?l? level voltage 0.9 1.1 1.3 v i ct 1 ct pin charge current v ct = 0.5 v 1.6 2.0 2.5 a i ct 2 ct pin discharge current v ct = 3.5 v 0.16 0.20 0.25 a r ct ct pin charge/discharge ratio i ct 1/i ct 2 8 10 12 times i s ? s s ? s pin discharge current v s ? s = 1 v 0.4 0.5 0.6 a
lb11867rv www. onsemi.com 3 electrical characteristics (t a = 25 c, v cc = 12 v) (continued) symbol unit max typ min conditions parameter v o nh outn output h-level voltage i o = 10 ma ? v cc ? 0.85 v cc ? 1.00 v v o nl outn output l-level voltage i o = 10 ma ? 0.9 1.00 v v o pl outp output l-level voltage i o = 10 ma ? 0.5 0.65 v vhn hall input sensitivity in + , in ? differential voltage (including offset and hysteresis) ? 10 20 mv v rd l rd output l-level voltage i rd = 5 ma ? 0.15 0.30 v i rd l rd pin leakage current v rd = 19 v ? ? 20 a ivth/irmi vth/rmi pin bias current cpwm = vth/rmi = 2 v ? ? 0.1 a product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. figure 1. p d max ? t a 03060 0 200 400 600 800 1000 ambient temperature, t a ? c allowable power dissipation, p d max ? mw 90 ? 30 120 mounted on a specified board: 114.3 76.1 1.6 mm glass epoxy board 352 95
lb11867rv www. onsemi.com 4 block diagram figure 2. block diagram truth table ? drive lock cpwm = h vth, rmi, s ? s = l in ? in+ ct out1p out1n out2p out2n fg mode h l l l l off h l out1 2 drive l h off h l l l out2 1 drive h l h off l off h off lock protection l h off h off l off truth table ? speed control ct, s ? s = l vth, rmi cpwm in ? in+ out1p out1n out2p out2n mode l h h l l l off h out1 2 drive l h off h l l out2 1 drive h l h l off l off h regeneration mode l h off h off l note: for vth, rmi, and s ? s pins, refer to the timing chart.
lb11867rv www. onsemi.com 5 application circuit figure 3. application circuit example (12 v) *1: power-gnd wiring sgnd is connected to the control circuit power supply system. *2: power stabilization capacitor for the power stabilization capacitor on the signal side, use the capacitance of 1 f or more. connect v cc and gnd with a thick and shortest pattern. *3: power stabilization capacitor on the power side for the power stabilization capacitor on the power side, use the capacitance of 1 f or more. connect the power supply on the power side and gnd with a thick and shortest pattern. *4: in + , in ? pins hall signal input pin. wiring should be short to prevent carrying of noise. if noise is carried, insert the capacitor between in + and in ? pins. the hall input circuit functions as a comparator with hysteresis (15 mv). this also has a soft switch section with 30 mv (input signal differential voltage). it is also recommended that the hall input level is minimum 100 mv(p ? p). *5: cpwm pin pin to connect the capacitor for generation of the pwm basic frequency the use of cp = 220 pf causes oscillation at f = 30 khz, which is the basic frequency of pwm. as this is used also for the current limiting canceling signal, be sure to connect the capacitor even when the speed control is not made. *6: rmi pin minimum speed setting pin. perform pull-up with 5vreg when this pin is not to be used. if the ic power supply is likely to be turned off first when the pin is used with external power supply, be sure to insert the current limiting resistor to prevent inflow of large current. (the same applies to the vth pin.)
lb11867rv www. onsemi.com 6 *7: vth pin speed control pin. connect this pin to gnd when it is not used (at full speed). for the control method, refer to the timing chart. for control with pulse input, insert the current limiting resistor and use the pin with the frequency of 20 khz to 100 khz (20 khz to 50 khz recommended). *8: sense pin current limiting detection pin. when the pin voltage exceeds 0.2 v, the current is limited and the operation enters the lower regeneration mode. connect this pin to gnd when it is not to be used. *9: rd pin lock detection pin. in open collector output, l upon rotation and h when locked (using pull-up resistance). keep this pin open when it is not to be used. *10: ct pin pin to connect the lock detection capacitor. the constant-current charge and discharge circuits incorporated cause locking when the pin voltage becomes 3.0 v and unlocking when it is 1.1 v. connect the pin to gnd when it is not to be used (locking not necessary). *11: s ? s pin pin to connect the soft-start setting capacitor. connect the capacitor between 5vreg and s ? s pin. this pin enables setting of the soft start time according to the capacity of the capacitor. see the timing char. connect the pin to gnd when it is not to be used.
lb11867rv www. onsemi.com 7 control timing chart (speed control) figure 4. control timing chart ? speed control 1. minimum speed setting (stop) mode the low-speed fan rotation occurs at the minimum speed set with the rmi pin. when the minimum speed is not set (rmi pin pulled up to 5vreg), the motor stops. 2. low speed ? high speed pmw control is made by comparing the cpwm oscillation voltage (1.1 v ? 3.0 v) and vth voltage. both upper and lower output trs are turned on when the vth voltage is low. the upper output tr is turned off when the vth voltage is high, regenerating the coil current in the lower tr. therefore, as the vth voltage decreases, the output on-duty increases, causing increase in the coil current, raising the motor rotation speed. 3. full speed mode the full speed mode becomes effective when the vth voltage is 1.1 v or less. (set vth = gnd when the speed control is not to be made.)
lb11867rv www. onsemi.com 8 control timing chart (soft start) 1. at vth < rmi voltage figure 5. at vth < rmi voltage 2. at vth > rmi voltage figure 6. at vth > rmi voltage adjust the s ? s pin voltage gradient by means of the capacitance of the capacitor between the s ? s pin and 5vreg. recommended capacitor: 0.1 f to 1 f
lb11867rv www. onsemi.com 9 ordering information device package wire bond shipping ? (qty / packing) lb11867rv ? mpb ? h ssop16 (225mil) (pb ? free / halogen free) au ? wire 90 / fan ? fold lb11867rv ? tlm ? e ssop16 (225mil) (pb ? free) au ? wire 2,000 / tape & reel lb11867rv ? tlm ? h ssop16 (225mil) (pb ? free / halogen free) au ? wire 2,000 / tape & reel lb11867rv ? w ? ah ssop16 (225mil) (pb ? free / halogen free) cu ? wire 2,000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d .
ssop16 (225mil) case 565am issue a date 23 oct 2013 xxxxxxxxxx ymddd xxxxx = specific device code y = year m = month ddd = additional traceability data generic marking diagram* *this information is generic. please refer to device data sheet for actual part marking. pb ? free indicator, ?g? or microdot ? ?, may or may not be present. soldering footprint* note: the measurements are not to guarantee but for reference only. (unit: mm) *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 1.0 5.80 0.32 0.65 mechanical case outline package dimensions http://onsemi.com 1 ? semiconductor components industries, llc, 2002 october, 2002 ? rev. 0 case outline number: xxx document number: status: new standard: description: 98aon66065e on semiconductor standard ssop16 (225mil) electronic versions are uncontrolled except when accessed directly from the document repository. printed versions are uncontrolled except when stamped ?controlled copy? in red. page 1 of 2
document number: 98aon66065e page 2 of 2 issue revision date o released for production from sanyo enact# s ? 010 to on semiconductor. req. by d. truhitte. 30 jan 2012 a added marking and solder footprint information. req. by d. truhitte. 23 oct 2013 ? semiconductor components industries, llc, 2013 october, 2013 ? rev. a case outline number: 565am on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner.
on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does on semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?

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